Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint ...出版済み 3週間でお届けいたします。
Title: Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces Subtitle: 1st ed. 2016 Series: Springer Theses Author: Zhang, Qingke Publisher: Springer ISBN: 9783662488218 Cover: HARDCOVER Date: 2015年11月 最近チェックした商品
9,865円(税896円)
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